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  6. Gigabyte H610M S2H V3 DDR4 - Placa base

Gigabyte H610M S2H V3 DDR4 - Placa base

  • Referencia: 1024906
  • Marca: GIGABYTE
  • P/N:

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Características de Gigabyte H610M S2H V3 DDR4

Especificaciones Gigabyte H610M S2H V3 DDR4:


Procesador
LGA1700 socket: Support for the 14th, 13th, and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
L3 cache varies with CPU
(Please refer "CPU Support List" for more information.)

Chipset
Intel® H610 Express Chipset

Memoria
Support for DDR4 3200/3000/2933/2666/2400/2133 MT/s memory modules
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to "Memory Support List" on GIGABYTE's website for more information.)

Gráfica Integrada
Integrated Graphics Processor-Intel® HD Graphics support:
- 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
- 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
* Support for HDMI 2.1 version and HDCP 2.3.
** Support native HDMI 2.1 TMDS compatible ports.

- 2 x DisplayPorts, supporting a maximum resolution of 4096x2304@60 Hz
* Support for DisplayPort 1.2 version and HDCP 2.3
(Graphics specifications may vary depending on CPU support.)
Support for up to triple-display at the same time

Audio
Realtek® Audio CODEC
High Definition Audio
2/4/5.1/7.1-channel
* You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.

LAN
Realtek® GbE LAN chip (1 Gbps/100 Gbps/10 Mbps

Zócalos de Expansión
CPU:
- 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16
Chipset:
- 1 x PCI Express x1 slot, supporting PCIe 3.0 and running at x1

Interfaz de almacenamiento
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 2280/2260 PCIe 3.0 x4/x2 SSD support)
- 4 x SATA 6Gb/s connectors

USB
Chipset:
- 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
- 4 x USB 2.0/1.1 ports on the back panel
Chipset+USB 2.0 Hub:
- 4 x USB 2.0/1.1 ports available through the internal USB headers

Conectores Internos E/S
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x M.2 Socket 3 connector
4 x SATA 6Gb/s connectors
1 x RGB LED strip header
1 x front panel header
1 x front panel audio header
1 x speaker header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 / GC-TPM2.0 SPI V2 module only)
1 x serial port header
1 x Clear CMOS jumper
1 x chassis intrusion header

Panel E/S Trasero
1 x PS/2 keyboard/mouse port
1 x D-Sub port
2 x DisplayPorts
1 x HDMI port
2 x USB 3.2 Gen 1 ports
4 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks

Controlador E/S
iTE® I/O Controller Chip

BIOS

1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Formato

Micro ATX Form Factor; 22.3cm x 19.3cm

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Información adicional:

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